SIRISHA, A. B. M.; THENTU, T. L.; HASEENA BANU, S. Adhesive bud method: A novel crossing technique in sesame (Sesamum indicum L.). INDIAN JOURNAL OF GENETICS AND PLANT BREEDING, [S. l.], v. 82, n. 03, p. 361–364, 2022. DOI: 10.31742/ISGPB.82.3.13. Disponível em: https://www.isgpb.org/journal/index.php/IJGPB/article/view/3403. Acesso em: 16 jun. 2025.